"Mechanical behavior of solder joints under dynamic four-point impact bending."

Tong An, Fei Qin, Jiangang Li (2011)

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DOI: 10.1016/J.MICROREL.2010.12.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong An, Fei Qin, Jiangang Li:
Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectron. Reliab. 51(5): 1011-1019 (2011)

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