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"Microstructural evolution of ultrasonically bonded high purity Al wire ..."

Pearl A. Agyakwa et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.08.018

access: closed

type: Journal Article

metadata version: 2024-07-06

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Pearl A. Agyakwa, Martin R. Corfield, Li Yang, Jianfeng Li, V. M. F. Marques, C. Mark Johnson:
Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. Microelectron. Reliab. 51(2): 406-415 (2011)

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