"Impact of thermal aging on the intermetallic compound particle size and ..."

Muhammad Aamir et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.09.022

access: closed

type: Journal Article

metadata version: 2022-12-27

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Muhammad Aamir, Riaz Muhammad, Naseer Ahmed, Muhammad Waqas:
Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics. Microelectron. Reliab. 78: 311-318 (2017)

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