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"The evaluation of mechanical stresses developed in underlying silicon ..."

D. Noonan et al. (2006)

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DOI: 10.1016/J.MEJO.2006.06.008

access: closed

type: Journal Article

metadata version: 2023-03-21

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D. Noonan, Patrick J. McNally, Weimin Chen, Aapo Lankinen, L. Knuuttila, Turkka O. Tuomi, Andreas N. Danilewsky, Rolf Simon:
The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography. Microelectron. J. 37(11): 1372-1378 (2006)

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