"Advancing the thermal stability of 3D ICs using logi-thermal simulation."

Gergely Nagy et al. (2015)

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DOI: 10.1016/J.MEJO.2015.06.025

access: closed

type: Journal Article

metadata version: 2020-03-27

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Gergely Nagy, Péter Horváth, László Pohl, András Poppe:
Advancing the thermal stability of 3D ICs using logi-thermal simulation. Microelectron. J. 46(12): 1114-1120 (2015)

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