"Novel accurate steady-state thermal resistance model for power chips ..."

Linhong Lu et al. (2024)

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DOI: 10.1016/J.MEJO.2024.106336

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type: Journal Article

metadata version: 2024-08-22

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Linhong Lu, Xinghua Fu, Rui Hu, Fashun Yang, Jiexin Lin, Zhongchen Bai, Kui Ma:
Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array. Microelectron. J. 151: 106336 (2024)

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