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"An efficient and simple compact modeling approach for 3-D interconnects ..."

Jean-Etienne Lorival et al. (2015)

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DOI: 10.1016/J.MEJO.2014.12.002

access: closed

type: Journal Article

metadata version: 2023-06-12

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Jean-Etienne Lorival, Françis Calmon, Fengyuan Sun, Felipe Frantz, Carole Plossu, Martine Le Berre, Ian O'Connor, Olivier Valorge, Jean Charbonnier, David Henry, Christian Gontrand:
An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration. Microelectron. J. 46(2): 153-165 (2015)

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