"Mechanism and thermal effect of delamination in light-emitting diode packages."

Jianzheng Hu, Lianqiao Yang, Moo Whan Shin (2007)

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DOI: 10.1016/J.MEJO.2006.08.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jianzheng Hu, Lianqiao Yang, Moo Whan Shin:
Mechanism and thermal effect of delamination in light-emitting diode packages. Microelectron. J. 38(2): 157-163 (2007)

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