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"Analysis of solder joint reliability of high power LEDs by transient ..."
Gordon Elger et al. (2015)
- Gordon Elger, Shri Vishnu Kandaswamy, E. Liu, Alexander Hanss, Maximilian Schmid, Robert Derix, Fosca Conti
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Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectron. J. 46(12): 1230-1238 (2015)
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