"Bond wire lift-off monitoring based on intersection point movement ..."

Mingxing Du et al. (2021)

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DOI: 10.1016/J.MEJO.2021.105202

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type: Journal Article

metadata version: 2021-10-05

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Mingxing Du, Jinlei Xin, Hongbin Wang, Ziwei Ouyang, Kexin Wei:
Bond wire lift-off monitoring based on intersection point movement characteristic in IGBT module. Microelectron. J. 116: 105202 (2021)

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