"Addressing the challenges of advanced packaging and interconnection."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Dennis J. Herrell (1993)

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DOI: 10.1109/40.207084

access: closed

type: Journal Article

metadata version: 2017-05-20

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Dennis J. Herrell:
Addressing the challenges of advanced packaging and interconnection. IEEE Micro 13(2): 10-18 (1993)

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