"Electrical modeling and simulation challenges in chip-package codesign."

Andreas C. Cangellaris (1998)

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DOI: 10.1109/40.710871

access: closed

type: Journal Article

metadata version: 2017-05-20

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  - https://dblp.org/rec/journals/micro/Cangellaris98
Andreas C. Cangellaris:
Electrical modeling and simulation challenges in chip-package codesign. IEEE Micro 18(4): 50-59 (1998)

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