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"A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm ..."

Hongtao Xu et al. (2011)

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DOI: 10.1109/JSSC.2011.2143930

access: closed

type: Journal Article

metadata version: 2020-10-26

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Hongtao Xu, Yorgos Palaskas, Ashoke Ravi, Masoud Sajadieh, Mohammed A. El-Tanani, Krishnamurthy Soumyanath:
A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application. IEEE J. Solid State Circuits 46(7): 1596-1605 (2011)

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