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"Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets ..."

Wei Tang et al. (2024)

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DOI: 10.1109/JSSC.2023.3343457

access: closed

type: Journal Article

metadata version: 2024-04-15

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  - journals/jssc/TangCHBZCLZTWMYYKFCTSZ24
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  - https://dblp.org/rec/journals/jssc/TangCHBZCLZTWMYYKFCTSZ24
Wei Tang, Sung-Gun Cho, Tim Tri Hoang, Jacob Botimer, Wei Qiang Zhu, Ching-Chi Chang, Cheng-Hsun Lu, Junkang Zhu, Yaoyu Tao, Tianyu Wei, Naomi Kavi Motwani, Mani Yalamanchi, Ramya Yarlagadda, Sirisha Rani Kale, Mark Flanigan, Allen Chan, Thungoc Tran, Sergey Y. Shumarayev, Zhengya Zhang:
Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration. IEEE J. Solid State Circuits 59(4): 1235-1245 (2024)

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