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"CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs."
Tianming Ni et al. (2020)
- Tianming Ni, Yue Shu, Hao Chang, Lin Lu, Guangzhen Dai, Shidong Zhu, Chengming Qu, Zhengfeng Huang:
CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs. J. Circuits Syst. Comput. 29(11): 2050144:1-2050144:19 (2020)
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