Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"The study of TSV-induced and strained silicon-enhanced stress in 3D-ICs."

Jindong Zhou et al. (2023)

> Home

Details and statistics

DOI: 10.1016/J.VLSI.2022.09.017

access: closed

type: Journal Article

metadata version: 2022-12-25

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/integration/ZhouCJZ23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/integration/ZhouCJZ23
Jindong Zhou, Yuyang Chen, Youliang Jing, Pingqiang Zhou:
The study of TSV-induced and strained silicon-enhanced stress in 3D-ICs. Integr. 88: 196-202 (2023)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.