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"Thermal aware placement in 3D ICs using quadratic uniformity modeling ..."

Haixia Yan, Qiang Zhou, Xianlong Hong (2009)

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DOI: 10.1016/J.VLSI.2008.06.001

access: closed

type: Journal Article

metadata version: 2020-02-20

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Haixia Yan, Qiang Zhou, Xianlong Hong:
Thermal aware placement in 3D ICs using quadratic uniformity modeling approach. Integr. 42(2): 175-180 (2009)

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