"Signal through-the-silicon via planning and pin assignment for thermal and ..."

Xu He, Sheqin Dong, Yuchun Ma (2010)

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DOI: 10.1016/J.VLSI.2010.06.001

access: closed

type: Journal Article

metadata version: 2020-02-20

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Xu He, Sheqin Dong, Yuchun Ma:
Signal through-the-silicon via planning and pin assignment for thermal and wire length optimization in 3D ICs. Integr. 43(4): 342-352 (2010)

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