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"Boundary scan based interconnect testing design for silicon interposer in ..."

Libao Deng, Ning Sun, Ning Fu (2020)

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DOI: 10.1016/J.VLSI.2020.02.006

access: closed

type: Journal Article

metadata version: 2020-03-24

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Libao Deng, Ning Sun, Ning Fu:
Boundary scan based interconnect testing design for silicon interposer in 2.5D ICs. Integr. 72: 171-182 (2020)

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