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"Application of multi-fidelity simulation modelling to integrated circuit ..."

Liam Y. Hsieh et al. (2016)

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DOI: 10.1504/IJSPM.2016.078525

access: closed

type: Journal Article

metadata version: 2023-06-26

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Liam Y. Hsieh, Edward Huang, Chun-Hung Chen, Si Zhang, Kuo-Hao Chang:
Application of multi-fidelity simulation modelling to integrated circuit packaging. Int. J. Simul. Process. Model. 11(3/4): 259-269 (2016)

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