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"A Novel Multi-Pattern Solder Joint Simultaneous Segmentation Algorithm for ..."

Lei Huang et al. (2019)

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DOI: 10.1142/S0218001420580057

access: closed

type: Journal Article

metadata version: 2020-05-11

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  - https://dblp.org/rec/journals/ijprai/HuangSXZHF19
Lei Huang, Shibin Shen, Fei Xie, Jing Zhao, Jianing Han, Kai Feng:
A Novel Multi-Pattern Solder Joint Simultaneous Segmentation Algorithm for PCB Selective Packaging Systems. Int. J. Pattern Recognit. Artif. Intell. 33(13): 2058005:1-2058005:21 (2019)

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