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"Analysing inspection frequency for wafer bumping process and an empirical ..."

Chen-Fu Chien, Chih-Han Hu, Chi-Yung Lin (2008)

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DOI: 10.1504/IJMTM.2008.017491

access: closed

type: Journal Article

metadata version: 2022-10-04

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Chen-Fu Chien, Chih-Han Hu, Chi-Yung Lin:
Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework. Int. J. Manuf. Technol. Manag. 14(1/2): 130-144 (2008)

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