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"The bond Strength Measurement of silicon-silicon bonding wafers Based on ..."

Liguo Chen, Tao Chen, Lining Sun (2006)

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DOI: 10.1142/S0219878906001088

access: closed

type: Journal Article

metadata version: 2020-10-22

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Liguo Chen, Tao Chen, Lining Sun:
The bond Strength Measurement of silicon-silicon bonding wafers Based on Crack Opening Method. Int. J. Inf. Acquis. 3(4): 339-347 (2006)

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