"Characterisation Of Electroplated Eutectic Sn-Ag Solder."

Z. W. Zhong, K. C. Chan, Y. H. Chen (2003)

> Home

Details and statistics

DOI: 10.1142/S1465876303002167

access: closed

type: Journal Article

metadata version: 2020-07-09

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/ijces/ZhongCC03
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ijces/ZhongCC03
Z. W. Zhong, K. C. Chan, Y. H. Chen:
Characterisation Of Electroplated Eutectic Sn-Ag Solder. Int. J. Comput. Eng. Sci. 4(3): 733-736 (2003)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.