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"Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the ..."

Tzong-Lin Wu et al. (2010)

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DOI: 10.1587/TRANSCOM.E93.B.1678

access: closed

type: Journal Article

metadata version: 2021-05-28

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  - https://dblp.org/rec/journals/ieicet/WuFPWSO10
Tzong-Lin Wu, Jun Fan, Francesco de Paulis, Chuen-De Wang, Antonio Ciccomancini Scogna, Antonio Orlandi:
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology. IEICE Trans. Commun. 93-B(7): 1678-1689 (2010)

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