"Through-Silicon-Via Characterization and Modeling Using a Novel One-Port ..."

An-Sam Peng et al. (2013)

Details and statistics

DOI: 10.1587/TRANSELE.E96.C.1289

access: closed

type: Journal Article

metadata version: 2020-04-11

a service of  Schloss Dagstuhl - Leibniz Center for Informatics