"Through-Silicon-Via Characterization and Modeling Using a Novel One-Port ..."

An-Sam Peng et al. (2013)

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DOI: 10.1587/TRANSELE.E96.C.1289

access: closed

type: Journal Article

metadata version: 2020-04-11

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  - https://dblp.org/rec/journals/ieicet/PengCWWCW13
An-Sam Peng, Ming-Hsiang Cho, Yueh-Hua Wang, Meng-Fang Wang, David Chen, Lin-Kun Wu:
Through-Silicon-Via Characterization and Modeling Using a Novel One-Port De-Embedding Technique. IEICE Trans. Electron. 96-C(10): 1289-1293 (2013)

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