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"Thermally Robust Nickel Silicide Process for Nano-Scale CMOS Technology."

Soon-Young Oh et al. (2005)

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DOI: 10.1093/IETELE/E88-C.4.651

access: closed

type: Journal Article

metadata version: 2020-04-11

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  - https://dblp.org/rec/journals/ieicet/OhYHKJHCKWL05
Soon-Young Oh, Jang-Gn Yun, Bin-Feng Huang, Yong-Jin Kim, Hee-Hwan Ji, Sang-Bum Huh, Han-Seob Cha, Ui-Sik Kim, Jin-Suk Wang, Hi-Deok Lee:
Thermally Robust Nickel Silicide Process for Nano-Scale CMOS Technology. IEICE Trans. Electron. 88-C(4): 651-655 (2005)

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