"TSV Geometrical Variations and Optimization Metric with Repeaters for 3D IC."

Hung Viet Nguyen, Myunghwan Ryu, Youngmin Kim (2012)

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DOI: 10.1587/TRANSELE.E95.C.1864

access: closed

type: Journal Article

metadata version: 2020-04-11

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  - https://dblp.org/rec/journals/ieicet/NguyenRK12
Hung Viet Nguyen, Myunghwan Ryu, Youngmin Kim:
TSV Geometrical Variations and Optimization Metric with Repeaters for 3D IC. IEICE Trans. Electron. 95-C(12): 1864-1871 (2012)

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