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"Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the ..."

Yung-Hao Lai et al. (2016)

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DOI: 10.1587/TRANSFUN.E99.A.1206

access: closed

type: Journal Article

metadata version: 2020-04-11

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  - journals/ieicet/LaiCFCK16
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  persistent URL:
  - https://dblp.org/rec/journals/ieicet/LaiCFCK16
Yung-Hao Lai, Yang-Lang Chang, Jyh-Perng Fang, Lena Chang, Hirokazu Kobayashi:
Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 99-A(6): 1206-1215 (2016)

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