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"Impact of ground solder ball failure in BGA package on near electric field ..."
Yidong Yuan et al. (2022)
- Yidong Yuan, Tianmeng Zhang, Ziren Wang
, Kaixuan Song, Lingyu Bi, Lu Tian, Jinchun Gao:
Impact of ground solder ball failure in BGA package on near electric field radiation. IEICE Electron. Express 19(17): 20220313 (2022)
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