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ORCID"Temperature properties of the parasitic resistance of through-silicon vias ..."
Yintang Yang et al. (2014)
- Yintang Yang, Xiaoxian Liu, Zhangming Zhu, Ruixue Ding:
Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs. IEICE Electron. Express 11(14): 20140504 (2014)
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