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"Study on thermal stress and keep-out zone induced by Cu and ..."

Fengjuan Wang, Ningmei Yu (2015)

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DOI: 10.1587/ELEX.12.20150844

access: open

type: Journal Article

metadata version: 2021-02-12

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  - electronic edition via DOI (open access)
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  dblp key:
  - journals/ieiceee/WangY15
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  - https://dblp.org/rec/journals/ieiceee/WangY15
Fengjuan Wang, Ningmei Yu:
Study on thermal stress and keep-out zone induced by Cu and SiO₂ filled coaxial-annular through-silicon via. IEICE Electron. Express 12(22): 20150844 (2015)

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