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"Research on Ni3Sn4 intermetallic compound for ..."

Fengwei Dai et al. (2022)

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DOI: 10.1587/ELEX.18.20210453

access: open

type: Journal Article

metadata version: 2022-04-21

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  dblp key:
  - journals/ieiceee/DaiZYWC22
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  persistent URL:
  - https://dblp.org/rec/journals/ieiceee/DaiZYWC22
Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang, Liqiang Cao:
Research on Ni₃Sn₄ intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps. IEICE Electron. Express 19(2): 20210453 (2022)

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