"Fabrication of through glass via (TGV) substrates using a pulse width ..."

Seung-Han Chung et al. (2025)

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DOI: 10.1587/ELEX.21.20240678

access: open

type: Journal Article

metadata version: 2025-03-24

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  - https://dblp.org/rec/journals/ieiceee/ChungPKLP25
Seung-Han Chung, Jin-Yeong Park, Yong-Kweon Kim, Seung-Ki Lee, Jae-Hyoung Park:
Fabrication of through glass via (TGV) substrates using a pulse width modulated (PWM) vacuum suction system for molten solder filling. IEICE Electron. Express 22(3): 20240678 (2025)

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