Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"A Throughput Study for Channel Bonding in IEEE 802.11ac Networks."

Mun-Suk Kim et al. (2017)

> Home

Details and statistics

DOI: 10.1109/LCOMM.2017.2747511

access: closed

type: Journal Article

metadata version: 2020-08-20

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/icl/KimRLG17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/icl/KimRLG17
Mun-Suk Kim, Tanguy Ropitault, SuKyoung Lee, Nada Golmie:
A Throughput Study for Channel Bonding in IEEE 802.11ac Networks. IEEE Commun. Lett. 21(12): 2682-2685 (2017)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.