"Metallization by plating for high-performance multichip modules."

Keith K. H. Wong, Suryanarayana Kaja, Patrick W. DeHaven (1998)

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DOI: 10.1147/RD.425.0587

access: closed

type: Journal Article

metadata version: 2020-03-13

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Keith K. H. Wong, Suryanarayana Kaja, Patrick W. DeHaven:
Metallization by plating for high-performance multichip modules. IBM J. Res. Dev. 42(5): 587-596 (1998)

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