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"Thermomechanical modeling of 3D electronic packages."

Sri M. Sri-Jayantha et al. (2008)

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DOI: 10.1147/JRD.2008.5388568

access: closed

type: Journal Article

metadata version: 2020-03-13

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  - journals/ibmrd/Sri-JayanthaMBK08
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  - https://dblp.org/rec/journals/ibmrd/Sri-JayanthaMBK08
Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker:
Thermomechanical modeling of 3D electronic packages. IBM J. Res. Dev. 52(6): 623-634 (2008)

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