"Wafer-level 3D integration technology."

Steven J. Koester et al. (2008)

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DOI: 10.1147/JRD.2008.5388565

access: closed

type: Journal Article

metadata version: 2021-10-14

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Steven J. Koester, Albert M. Young, Roy R. Yu, Sampath Purushothaman, Kuan-Neng Chen, Douglas C. La Tulipe Jr., Narender Rana, Leathen Shi, Matthew R. Wordeman, Edmund J. Sprogis:
Wafer-level 3D integration technology. IBM J. Res. Dev. 52(6): 583-597 (2008)

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