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"IBM POWER9 package technology and design."

Sungjun Chun et al. (2018)

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DOI: 10.1147/JRD.2018.2847178

access: closed

type: Journal Article

metadata version: 2021-09-23

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  - https://dblp.org/rec/journals/ibmrd/ChunBCODHNBE18
Sungjun Chun, Wiren Dale Becker, Jon Casey, Steve Ostrander, Daniel Dreps, Jose Ale Hejase, Ryan Nett, Brian Beaman, Jason R. Eagle:
IBM POWER9 package technology and design. IBM J. Res. Dev. 62(4/5): 12:1-12:10 (2018)

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