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"Effects of mechanical stress and moisture on packaging interfaces."
Stephen L. Buchwalter et al. (2005)
- Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad:
Effects of mechanical stress and moisture on packaging interfaces. IBM J. Res. Dev. 49(4-5): 663-676 (2005)
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