"Chip and Package-Scale Interconnects for General-Purpose, Domain-Specific, ..."

Abhijit Das et al. (2024)

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DOI: 10.1109/JETCAS.2024.3445829

access: closed

type: Journal Article

metadata version: 2024-10-03

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Abhijit Das, Maurizio Palesi, John Kim, Partha Pratim Pande:
Chip and Package-Scale Interconnects for General-Purpose, Domain-Specific, and Quantum Computing Systems - Overview, Challenges, and Opportunities. IEEE J. Emerg. Sel. Topics Circuits Syst. 14(3): 354-370 (2024)

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