"A novel efficient TSV built-in test for stacked 3D ICs."

Badi Guibane et al. (2018)

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DOI: 10.3906/ELK-1711-220

access: open

type: Journal Article

metadata version: 2021-06-04

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  - https://dblp.org/rec/journals/elektrik/GuibaneHBM18
Badi Guibane, Belgacem Hamdi, Brahim Bensalem, Abdellatif Mtibaa:
A novel efficient TSV built-in test for stacked 3D ICs. Turkish J. Electr. Eng. Comput. Sci. 26(4): 1909-1921 (2018)

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