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"Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin ..."

Caleb Serafy et al. (2016)

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DOI: 10.1109/MDAT.2015.2480710

access: closed

type: Journal Article

metadata version: 2022-11-17

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  - journals/dt/SerafyYSHJ16
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  persistent URL:
  - https://dblp.org/rec/journals/dt/SerafyYSHJ16
Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi:
Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks. IEEE Des. Test 33(2): 40-48 (2016)

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