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"Demystifying 3D ICs: The Pros and Cons of Going Vertical."
W. Rhett Davis et al. (2005)
- W. Rhett Davis
, John M. Wilson, Stephen E. Mick, Jian Xu, Hao Hua, Christopher Mineo, Ambarish M. Sule, Michael B. Steer, Paul D. Franzon
:
Demystifying 3D ICs: The Pros and Cons of Going Vertical. IEEE Des. Test Comput. 22(6): 498-510 (2005)
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