"Reliability Challenges Related to TSV Integration and 3-D Stacking."

Kristof Croes et al. (2016)

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DOI: 10.1109/MDAT.2015.2501302

access: closed

type: Journal Article

metadata version: 2025-03-03

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  - https://dblp.org/rec/journals/dt/CroesMLGPCSWB16
Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne:
Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test 33(3): 37-45 (2016)

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