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"3D Chip Stack Technology Using Through-Chip Interconnects."
Peter Benkart et al. (2005)
- Peter Benkart, Alexander Kaiser, Andreas Munding
, Markus Bschorr, Hans-Jörg Pfleiderer, Erhard Kohn, Arne Heittmann, Holger Huebner, Ulrich Ramacher:
3D Chip Stack Technology Using Through-Chip Interconnects. IEEE Des. Test Comput. 22(6): 512-518 (2005)
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