"Removing epoxy underfill between neighbouring components using acid for ..."

Thibaut Heckmann et al. (2019)

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DOI: 10.1016/J.DIIN.2019.04.003

access: closed

type: Journal Article

metadata version: 2020-08-20

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  - https://dblp.org/rec/journals/di/HeckmannMMAN19
Thibaut Heckmann, James P. McEvoy, Konstantinos Markantonakis, Raja Naeem Akram, David Naccache:
Removing epoxy underfill between neighbouring components using acid for component chip-off. Digit. Investig. 29: 198-209 (2019)

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