"Designing High-Performance and Thermally Feasible Multi-Chiplet ..."

Harsh Sharma et al. (2025)

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DOI: 10.48550/ARXIV.2507.18040

access: open

type: Informal or Other Publication

metadata version: 2025-08-18

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  - journals/corr/abs-2507-18040
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  - https://dblp.org/rec/journals/corr/abs-2507-18040
Harsh Sharma, Janardhan Rao Doppa, Ümit Y. Ogras, Partha Pratim Pande:
Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures enabled by Non-bendable Glass Interposer. CoRR abs/2507.18040 (2025)

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