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"SolderlessPCB: Reusing Electronic Components in PCB Prototyping through ..."

Zeyu Yan et al. (2024)

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DOI: 10.48550/ARXIV.2403.18797

access: open

type: Informal or Other Publication

metadata version: 2024-04-10

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  - journals/corr/abs-2403-18797
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  - https://dblp.org/rec/journals/corr/abs-2403-18797
Zeyu Yan, Jiasheng Li, Zining Zhang, Huaishu Peng:
SolderlessPCB: Reusing Electronic Components in PCB Prototyping through Detachable 3D Printed Housings. CoRR abs/2403.18797 (2024)

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