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"Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels ..."

David Cuesta et al. (2024)

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DOI: 10.48550/ARXIV.2402.14627

access: open

type: Informal or Other Publication

metadata version: 2024-03-22

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  - journals/corr/abs-2402-14627
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  - https://dblp.org/rec/journals/corr/abs-2402-14627
David Cuesta, José L. Risco-Martín, José L. Ayala, José Ignacio Hidalgo:
Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization. CoRR abs/2402.14627 (2024)

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